Since 2024, driven by downstream factors such as AI servers, 5G base stations, and optical modules, the PCB industry has shown a dual logic resonance of “cycle+growth”, with the off-season output value in the first quarter exceeding 8% of the same period last year.
High speed, high-frequency, high layer count, and high heat dissipation requirements for data communication PCBs (such as switch backboards and GPU power modules) have become the incremental core, and the utilization rate of leading domestic manufacturers remains high at 8.
This trend reflects that computing infrastructure is shifting from “general computing” to “specialized acceleration”, proposing new standards for the dielectric properties and signal integrity of PCB materials.