1 foot = 12 inches 1 inch = 1000 mils 1mil=25.4um 1mil = 1000uin mil, sometimes also into English silk 1um = 40uin (some companies call micro inch wheat, which is actually micro inch) 1oz = 28.35 g / SF = 35 microns (copper thickness) H = 18 microns 4mil / 4mil = 0.1mm/0.1mm line [...]
Impedance matching is a part of microwave electronics. It is mainly used in transmission lines to achieve the purpose that all high-frequency microwave signals can be transmitted to the load point, and no signal will be reflected back to the source point, so as to improve energy efficiency. In general, there are two kinds of [...]
In the process of research and development or learning, you often need to buy a small number of films. At this time, you can only find goods in the electronic market. The goods in the market are mixed. You should learn to distinguish between good and bad. Here are some problems faced by IC spot: [...]
Brief description of QFN package QFN (quad flat no leads package) is a pin free package, which is square or rectangular. There is a large area of exposed pad in the center of the bottom of the package for heat conduction, and there are conductive pads for electrical connection around the package periphery of the [...]
The data show that compared with the domestic market, the demand for semiconductor chip base and probe in 2019 is US $182million, accounting for only about 15% of the global market. This data is obviously inconsistent with China's annual consumption of about 33% of the global chips. It is understood that the data deviation here [...]
The core of upstream material is substrate Packaging substrate is the largest cost of IC packaging, accounting for more than 30%. IC packaging cost includes packaging substrate, packaging materials, equipment depreciation and testing, of which the cost of IC carrier board accounts for more than 30%. It is the most expensive in IC packaging and [...]
The rapid development of electronic information industry makes electronic products develop in the direction of miniaturization, functionalization, high performance and high reliability. From the general surface mount technology (SMT) in the mid-1970s to the high-density interconnect surface mount technology (HDI) in the 1990s, and the application of various new packaging technologies such as semiconductor packaging [...]
Modulation is the process of processing the coded information of the signal source to make it suitable for transmission. Generally speaking, this means that the baseband signal (source) is transformed into a band communication signal with a very high frequency relative to the baseband frequency. This band communication signal is called modulated signal, and the [...]
Communication equipment Communication equipment, 76 companies, with a total market value of 750 billion, pe57. The index has been quite weak in recent years. It reached a peak of 6500 in 2015 and fell below 2000 at the end of 2018. The peak in recent years has stopped at 3800 for three times. It has [...]
Brief description of QFN package QFN (quad flat no leads package) is a pin free package, which is square or rectangular. There is a large area of exposed pad in the center of the bottom of the package for heat conduction, and there are conductive pads for electrical connection around the package periphery of the [...]