According to industry estimates, the PCB value of a single 5G base station is about five times that of a 4G base station, mainly due to the increasing demand for multi-layer, high-frequency high-speed boards such as RF front-end, Massive MIMO antenna array, and high-speed return interface.
However, the core formula and patents of upstream high-frequency copper-clad laminates (such as PTFE and LCP substrates) are still monopolized by American and Japanese companies, with a localization rate of less than 30%, becoming a weak link in the industrial chain security.
This contradiction is driving domestic material companies to collaborate with universities to carry out military to civilian technology research and accelerate the process of independent substitution of high-frequency substrates.