With the increase in training and inference tasks for generative AI models, the global demand for high-performance computing hardware has surged. This has directly driven the widespread application of high-precision multi-layer printed circuit boards with more than 20 layers, especially in data center switches and GPU interconnect modules, where high-frequency and high-speed PCBs have become key supporting components. It is predicted that the scale of intelligent computing power will increase by 43% year-on-year in 2025, further driving the usage of high-end PCBs.
