Recently, significant progress has been made in flexible printed circuit board (FPC) technology. Researchers have developed a new type of insulating substrate for FPCs that offers even greater flexibility and durability. This new substrate can withstand more bending and folding cycles without damage to the conductive traces. As a result, FPCs made with this substrate are expected to be used in more demanding applications such as wearable devices and flexible displays. The development could revolutionize the design and functionality of future electronic products, as it allows for more creative and space – efficient circuit designs.
