To commemorate the 54th anniversary of the Intel 4004 processor, the technical team reconstructed the MCS-4 computer system using discrete components and built a complete logical architecture around seven giant printed circuit boards. These PCBs correspond to CPU, ROM, RAM, and shift register modules, successfully reproducing the functionality of the original Busicom calculator and demonstrating [...]
A processing and placement rack for the production process of printed circuit boards has made technological progress. Through the design of U-shaped racks and sliding connection pins, it achieves stable load-bearing and rapid batch picking and placing of multi-layer copper-clad laminates. This device improves the flow efficiency of materials in the front-end process, reduces the [...]
The key to the publication of the manufacturing method of a new type of high-frequency transmission flexible printed circuit board is to use polyimide aerogel resin as the dielectric material. This material has excellent dielectric properties and thermal stability, which can meet the requirements of high-speed signal transmission and demonstrate potential in high-frequency application scenarios [...]
A new patent has been disclosed for a printed circuit board anti solder plug hole air guide plate, which adopts a foldable connection frame and a multi-stage placement board structure, supporting the adjustment of air guide hole layout according to different specifications of PCB boards. This flexible design enhances the compatibility of the gas guiding [...]
A new type of printed circuit board beveling machine has obtained patent authorization, and its core improvement lies in the integration of an automatic feeding bucket and a pushing block structure. This design can automatically push the bottom PCB board forward into the cutting station during the operation of the conveyor belt, and at the [...]
To address the challenge of electronic waste, research institutions have successfully developed environmentally friendly PCB materials using plant cellulose as a reinforcement and biodegradable resin as a matrix. This substrate has stable performance under normal usage conditions, but can decompose into harmless substances within a few months in specific composting environments. Although it cannot yet [...]
With the mass deployment of several giant low orbit satellite Internet projects around the world, the on-board electronic equipment has strict requirements for high-frequency, lightweight and irradiation resistant PCBs. The L/Ka band communication module commonly uses special substrates with extremely low dielectric loss (such as PTFE composite materials), and is combined with precision laser drilling [...]
A new hardware development model is emerging - engineers only need to input "design a low-power IoT control board that supports Wi Fi 6E and Bluetooth 5.3", and AI systems can automatically generate schematics and PCB layouts that comply with electrical specifications, and output Gerber files that can be delivered for production. This technology relies [...]
Standard multi-layer PCB manufacturing requires dozens of processes including inner layer graphic etching, lamination, through-hole metallization, outer layer electroplating, solder mask, character printing, surface treatment, and electrical testing. Its core lies in interlayer alignment accuracy and conductivity reliability, reflecting the precision manufacturing attributes of PCB as the "mother of electronic products".
With the increasing demand for AI servers, cloud computing, and 5G communication equipment, the market's technical requirements for high-frequency, high-speed, high-density interconnect (HDI), and packaging substrate PCBs continue to rise. The industry is shifting from traditional "cyclicality" to a dual wheel drive of "growth+cycle", driving the development of PCBs towards higher layers, smaller linewidths, and [...]