NASA Investigates Techniques for Cooling 3-D Integrated Circuits Stacked Like a Skyscraper
Future integrated circuitry is expected to look a lot like skyscrapers: units will be stacked atop one another and interconnects will link each level to its adjacent neighbors, much like how elevators connect one floor to the next. The problem is how do integrated-circuit designers remove heat from these tightly packed 3-D chips? The smaller [...]