Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates. Using a unique nanomanufacturing process, nanomaterial is created, dispersed, and sintered, resulting in copper foil of one micron or less. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic [...]
As part of a recent I-Connect007 supply chain survey, we found that RF laminate material can be very difficult to obtain. Rogers Corporation was named specifically in our survey as one supplier with a limited amount of material available. In fact, their delivery time was reported as being as high as 55 days for some [...]
PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of [...]
For this issue of SMT Magazine, the i-connect007 team opted for a different approach when it came to planning the editorial content of the magazine. Our topic is the supply chain segment of the electronics assembly industry, and it is the singular topic this month for all our titles—SMT Magazine, The PCB Magazine, and [...]
XJY PCB will Participate in Global sources electronic components show in October 2015. Information as below： Exhibition name : Global Sources Electronic Components Show Date of Exhibition : October 2015 Place : AsiaWorld-Expo , Hong Kong Booth NO. : 9G13 We participate in electronic components show of New Delhi April 2015 participate electronic compontes in HongKong. In the New Delhi and HongKong fair has [...]
High-density interconnection (HDI) PCB technology is advancing to enable increased miniaturization and functionality of products such as smartphones, tablet computers and wearable devices. This dictates continual reduction in feature size for conductor line width and spacing, micro-via pad diameter and pitch, and conductor and insulating layer thickness to accommodate more components and layers without increasing [...]
IPC — Association Connecting Electronics Industries announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales were down slightly but orders were up. The book-to-bill ratio held steady at 1.02. Total North American PCB shipments decreased 4.2 percent in May 2015 from May 2014, and year-to-date [...]
ICT Technical Director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of Circuit Technology Annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in Dudley, in the West Midlands [...]
Brian Haken, one of the PCB industry's great leaders and visionaries, has passed away. An inspiration to many in the PCB field, Haken helped form the close ties and friendships that have bonded UK's PCB industry together for many years. Haken worked for E.K. Cole TV, before moving to Multitone Electronics, and to South East [...]
Although flex circuits are nothing new in today’s technology roadmap, the testing of unpopulated flexible circuits can be challenging. These circuits can be very thin, have challenging geometrical configurations and in some cases be a combination of rigid bare board and flex. There are basically three different methods available to test these challenging circuits: manual, [...]