| Item | Capability | Item | Capability |
| Layers | 1-28 | Thicker Copper | 1-6oz |
| Products Type | HF(High-Frequency)&(Radio Frequency)board, Imedance controlled board,HDIboard, BGA& Fine pitch board | solder mask | Nanya&Taiyo, LPI&Matt red, green,yellow,white,blue,black. |
| Base Material | FR4(Shengyi China, ITEQ, KB A+,HZ),HI-TG,Fr06,Rogers,Taconic,Argon,Naclo,Isola and so on | Finished Surface | Conventional HASL, Lead-Free HASL,Flash Gold,ENIG(Immersion Gold),OSP(Entek),Immersion Tin, Immersion Sliver, Hard Gold |
| Selective Surface Treatment | EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger | ||
| Technical Specification | Minimum line width/gap | 3.5/4mil(laser dirll) | |
| Minimum Hole Size | 0.15mm(mechanical dirll) 4mil(laser dirll) | ||
| Minimum Annular Ring | 4mil | ||
| Max Copper Thickness | 6oz | ||
| Max Production Size | 600mm*800mm | ||
| Board Thickness | D/S:0.2-7.0mm, Multilayer:0.40-7.0mm | ||
| Min Solder Mask Bridge | ≥0.08mm | ||
| Aspect Ratio | 15:1 | ||
| Plugging Vias Capability | 0.2-0.8mm | ||
| Tolerance | Plated holes Tolerance | ±0.08mm(min±0.05) | |
| Non-Plated Hole Tolerance | ±0.05mm(min+0/-0.05mm or +0.05/-0mm) | ||
| Outline Tolerance | ±0.15mm(min±0.10mm) | ||
| Functional Test | |||
| Insulating Resistance | 50ohms(normality) | ||
| Peel Off Strength | 1.4N/mm | ||
| Thermal Stress Test | 265℃,20seconds | ||
| Solder Mask Hardness | 6H | ||
| E-test Voltage | 500V+15/-0V 30s | ||
| Warp and Twist | 0.7%(Semiconductor test board 0.3%) | ||